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W311 Datasheet, PDF (15/19 Pages) Silicon Laboratories – FTG for VIA™ Pro-266 DDR Chipset
W311
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause per-
manent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specifi-
cation is not implied. Maximum conditions for extended peri-
ods may affect reliability.
Parameter
Description
Rating
Unit
VDD, VIN
TSTG
TB
TA
ESDPROT
Voltage on Any Pin with Respect to GND
Storage Temperature
Ambient Temperature under Bias
Operating Temperature
Input ESD Protection
–0.5 to +7.0
V
–65 to +150
°C
–55 to +125
°C
0 to +70
°C
2 (min.)
kV
DC Electrical Characteristics: TA = 0°C to +70°C, 3.3V, VDD = 3.3V±5%, 2.5V, VDD = 2.5V±5%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
IDD
3.3V Supply Current
IDD
2.5V Supply Current
Logic Inputs
CPU1:3 = 133 MHz [2]
150
mA
50
mA
VIL
Input Low Voltage
VIH
Input High Voltage
IIL
Input Low Current[3]
IIH
Input High Current[3]
Clock Outputs
GND – 0.3
2.0
0.8
V
VDD + 0.3
V
–25
µA
10
µA
VOL
Output Low Voltage
IOL = 1 mA
VOH
Output High Voltage
IOH = –1 mA
3.1
VOH
Output High Voltage CPU1:3,
IOH = –1 mA
2.2
APIC0:2
50
mV
V
V
IOL
Output Low Current CPU1:3
VOL = 1.25V
PCI_F, PCI1:8 VOL = 1.5V
AGP0:2
VOL = 1.25V
APIC0:2
VOL = 1.25V
REF0:1
VOL = 1.5V
48-MHz
VOL = 1.5V
24-MHz
VOL = 1.5V
IOH
Output High Current CPU1:3
VOH = 1.25V
PCI_F, PCI1:8 VOH = 1.5V
AGP0:2
VOL = 1.25V
APIC0:1
VOH = 1.5V
48-MHz
VOH = 1.5V
24-MHz
VOH = 1.5V
Notes:
2. All clock outputs loaded with 6" 60Ω transmission lines with 22-pF capacitors.
3. Inputs have internal pull-up resistors.
27
57
97
mA
20.5
53
139
mA
40
85
140
mA
40
85
140
mA
25
37
76
mA
25
37
76
mA
25
37
76
mA
25
55
97
mA
31
55
139
mA
40
85
140
mA
27
44
94
mA
27
44
94
mA
25
37
76
mA
15