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BCM88335 Datasheet, PDF (139/140 Pages) Cypress Semiconductor – Single-Chip 5G Wi-Fi IEEE 802.11ac MAC/Baseband/ Radio with Integrated Bluetooth 4.1 for Automotive Applications
BCM88335 Data Sheet
Ordering Information
Section 22: Ordering Information
Part Number
Package
Description
Operating
Ambient
Temperature
BCM88335L2CUBGa 145 ball WLBGA (4.87 mm ×
5.413 mm, 0.4 mm pitch)
Dual-band 2.4 GHz and 5 GHz
WLAN + BT 4.1 for Automotive
Applications
–40°C to +85°C
a. BCM88335L2CUBG offers an updated solder ball composition to improve thermal cycling performance.
Assembly processes are not affected. Form, fit, and function are unchanged.
Broadcom®
September 23, 2015 • 88335-DS100-R
BROADCOM CONFIDENTIAL
Page 138