S29GL01GT Datasheet, PDF (1/105 Pages) Cypress Semiconductor – 1 Gbit (128 Mbyte), 512 Mbit (64 Mbyte)

S29GL01GT, S29GL512T
1 Gbit (128 Mbyte), 512 Mbit (64 Mbyte)
GL-T MirrorBit^® Eclipse™ Flash
General Description
The Cypress^® S29GL01GT/512T are MirrorBit^® Eclipse™ flash products fabricated on 45 nm process technology. These devices
offer a fast page access time as fast as 15 ns, with a corresponding random access time as fast as 100 ns. They feature a Write
Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective programming
time than standard programming algorithms. This makes these devices ideal for today’s embedded applications that require higher
density, better performance, and lower power consumption.
Distinctive Characteristics
 45 nm MirrorBit Eclipse Technology
 Single supply (V_CC) for read / program / erase (2.7 V to
3.6 V)
 Versatile I/O feature
– Wide I/O voltage range (V_IO): 1.65 V to V_CC
 x8/x16 data bus
 Asynchronous 32-byte Page read
 512-byte Programming Buffer
– Programming in Page multiples, up to a maximum of 512
bytes
 Single word and multiple program on same word options
 Automatic Error Checking and Correction (ECC) — internal
hardware ECC with single bit error correction
 Sector Erase
– Uniform 128-kbyte sectors
 Suspend and Resume commands for Program and Erase
operations
 Status Register, Data Polling, and Ready/Busy pin methods
to determine device status
 Advanced Sector Protection (ASP)
– Volatile and non-volatile protection methods for each
sector
 Separate 2048-byte One Time Program (OTP) array
– Four lockable regions (SSR0 - SSR3)
– SSR0 is Factory Locked
– SSR3 is Password Read Protect
 Common Flash Interface (CFI) parameter table
 Temperature Range / Grade:
– Industrial (40 °C to +85 °C)
– Industrial Plus (40 °C to +105 °C)
– Extended (40 °C to +125 °C)
– Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
– Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
 100,000 Program / Erase Cycles
 20-year data retention
 Packaging Options
– 56-pin TSOP
– 64-ball LAA Fortified BGA, 13 mm  11 mm
– 64-ball LAE Fortified BGA, 9 mm  9 mm
– 56-ball VBU Fortified BGA, 9 mm  7 mm
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-00247 Rev. *G
• San Jose, CA 95134-1709 • 408-943-2600
Revised October 27, 2016