DS-72-11 Datasheet, PDF (13/14 Pages) Cymbet Corporation – Charge Pump and Battery Management ASIC Bare Die

CBC910 Partial Wafer Map when Purchasing wafers
126.35 (street center to pad center)
126.35 (street center to pad center)
CBC910
328.4
(street center
to pad center)
340.35
(street center
to pad center)
Notes:
1) Scribe lane is
150um (x)
150um (y)
2) Die thickness is
150um minimum.
200um maximum.
3) All dimensions in microns.
©2012-2014 Cymbet Corporation • Tel: [phone] • www.cymbet.com
DS-72-11 Rev A

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