HP3 Datasheet, PDF (5/6 Pages) CTS Corporation – METAL CASE, CASE-MOUNTED SEMICONDUCTORS

17. Hole pattern no. 202 accommodates T0-3 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available
in UP, UP1, UP2, HP1, and HP3 series heat dissipators.
19. Hole pattern no. 2 accommodates T0-6s or T0-36s.
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other
1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0-
66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,
HP1, and HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.