HP3 Datasheet, PDF (1/6 Pages) CTS Corporation – METAL CASE, CASE-MOUNTED SEMICONDUCTORS

METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
Series HP3
Technical
HP3 Series for Single TO-3 or Stud Mount
DESCRIPTION OF CURVES
A. N.C. Horiz. Device Only
Mounted to G-10.
B. N.C Horiz. & Vert. With
Dissipator.
C. 200 FPM w/Diss.
D. 500 FPM w/Diss.
E. 1000 FPM w/Diss.
• Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
• Derate 1.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated
HP3-000-U
HP3-T03-U
HP3-T03-33U
CTS IERC PART NO.
Comm'l. Black
Anodize
HP3-000-CB
HP3-T03-CB
HP3-T03-33CB
Mil. Black Anodize
HP3-000-B
HP3-T03-B
HP3-T03-33B
Semiconductor
Accommodated
Undrilled
T0-3
T0-3 IC
Hole patt. ref.
no.
--
16
17
Max. Weight
(Grams)
55.0
55.0
55.0