HP3 Datasheet, PDF (2/6 Pages) CTS Corporation – METAL CASE, CASE-MOUNTED SEMICONDUCTORS

HP3-T03-44U
HP3-T03-44CB
HP3-T03-44B
T0-3 PANEL MOUNT
31
55.0
HP3-436-U
HP3-436-CB
HP3-436-B
T0-3 (4 PIN)
18
55.0
HP3-T015-U
HP3-T015-CB
HP3-T015-B
T0-15, D0-5
23
55.0
HP3-T06-U
HP3-T06-CB
HP3-T06-B
T0-6, T0-36
19
55.0
HP3-420-U
HP3-420-CB
HP3-420-B
UNIVERSAL
27
55.0
HP3 for Dual TO-3 Outline
DESCRIPTION OF CURVES
A. N.C. Horiz. Device Only
Mounted to G-10.
B. N.C Horiz. & Vert. With
Dissipator.
C. 200 FPM w/Diss.
D. 500 FPM w/Diss.
E. 1000 FPM w/Diss.
• Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
• Derate 2.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated
HP3-T03-4U
HP3-437-U
CTS IERC PART NO.
Comm'l. Black
Anodize
HP3-T03-4CB
HP3-437-CB
Mil. Black Anodize
HP3-T03-4B
HP3-437-B
Semiconductor
Accommodated
Two TO-3s
Two TO-3s (4 pin)
Hole patt. ref.
no.
6
12
Max. Weight
(Grams)
55.0
55.0