C4D20120A Datasheet, PDF (5/6 Pages) Cree, Inc – Silicon Carbide Schottky Diode

Package Dimensions
Package TO-220-2
A
J
F
C
B
D
E
12
G
Z
H
L
M
N
P
Q
S
T
U
V
W
PIN 1
PIN 2
CASE
Recommended Solder Pad Layout
POS
Inches
Min
Max
Millimeters
Min
Max
A
.381
.410
9.677
10.414
B
CP OS
D_A
.235
.^I1ⁿ0^c0^hes
M in M ax
.39^.5²²³ .410
.255
5.969
.120^{M illim ete}2^r.^s540
M in M ax
.3₁3₀7_{.033 10}5_.4.6₁₄64
6.477
3.048
8.560
E _{B .23}.₅590 _.255 .6₅1_.5_{969 6}1_.44₇.9₇86
15.621
X
F C .10.2143 .112 .1523.591 23.8.46532
3.886
G ^{D .33}1⁷.105 ^.337 1.1⁸4^.57^{60 8}2^.58⁶.0⁰67
29.134
E .590 .610 14.986 15.494
Y
H
F
.500
.550
12.700
.149
.153 3.785 3.886
13.970
J _{G 1.127} R ₁0_.1.₄1₇97 _{28.626 29.134} R 0.197
L H .53.0025 .550 .0136.462 13..967305
.914
M^J
N^L
M
P_N
Q_P
.^R04⁰5^.010
.02_.8₁₉₅ .036
.045 .055
.19^.5¹⁶⁵ .205
.17^.0⁰⁴⁸ .180
.055 ^{R 0.254}1.143
.20^.5⁷¹¹
1.143
.1₄8_.5₉₅₃
.₄91_.4₉₅₃
1.397
5⁴.2^.0¹7⁹¹
.05₄4_{.318 4}1_.5.₇2₂19
1.397
5.207
4.699
1.372
S Q .0483° .054 6°1.219 1.3731°
6°
T^S
T
U
U
V_V
3°_3° 5°
3°
5°
3°
3°
5°
.10^.0⁰⁹⁴ .110
6° ^{3 °}
3°
6°
3°
.11₂0_.54
5°_3°
5°
3°
5°
2².7^.9³4⁸⁸
6°
6°
2.794
W W .01.4014 .021 .02.3556 .5.33356
.635
X^X
Y^Y
Z
z
3°_3° 5°
.39_.5₃₈₅ .410
.130 .150
.130
5.5°^3°
.4¹1⁰0^.033
3.302
.150
5°_3°
10₉.4_.714₇₉
3.810
3.302
5.5°
10.414
3.810
NOTE:
1. Dimension L, M, W apply for Solder Dip
Finish
TO-220-2
Part Number
C4D20120A
Package
TO-220-2
Marking
C4D20120
Note: Recommended soldering profiles can be found in the applications note here:
http://www.cree.com/power_app_notes/soldering
5
C4D20120A Rev. C