CMPA801B025D Datasheet, PDF (3/7 Pages) Cree, Inc – 25 W, 8.0 - 11.0 GHz, GaN MMIC, Power Amplifier

Die Dimensions (units in microns)
Overall die size 4780 x 3610 (+0/-50) microns, die thickness 100 (+/-10) micron.
All Gate and Drain pads must be wire bonded for electrical connection.
Pad Number
1
2
3
4
5
6
7
8
9
10
Function
RF-IN
VG1_A
VG1_B
VD1_A
VD1_B
VG2_A
VG2_B
VD2_A
VD2_B
RF-Out
Description
RF-Input pad. Matched to 50 ohm.
Gate control for stage 1. V_G ~ 2.0 - 3.5 V.
Gate control for stage 1. V_G ~ 2.0 - 3.5 V.
Drain supply for stage 1. V_D = 28 V.
Drain supply for stage 1. V_D = 28 V.
Gate control for stage 2A. V_G ~ 2.0 - 3.5 V.
Gate control for stage 2A. V_G ~ 2.0 - 3.5 V.
Drain supply for stage 2A. V_D = 28 V.
Drain supply for stage 2B. V_D = 28 V.
RF-Output pad. Matched to 50 ohm.
Pad Size (microns)
150 x 150
100 x 100
100 x 100
100 x 100
100 x 100
100 x 100
100 x 100
–
–
150 x 150
Note
4
1,2
1,2
1
1
1,3
1,3
1
1
4
Notes:
1 _{Attach bypass capacitor to pads 2-9 per application circuit.}
2 _{VG1_A and VG1_B are connected internally so it would be enough to connect either one for proper operation.}
3 _{VG2_A and VG2_B are connected internally so it would be enough to connect either one for proper operation.}
4 _{The RF Input and Output pad have a ground-signal-ground with a nominal pitch of 1 mil (25 um). The RF}
ground pads are 100 x 200 microns.
Die Assembly Notes:
• Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at http://www.cree.com/products/wireless_appnotes.asp
• Vacuum collet is the preferred method of pick-up.
• The backside of the die is the Source (ground) contact.
• Die back side gold plating is 5 microns thick minimum.
• Thermosonic ball or wedge bonding are the preferred connection methods.
• Gold wire must be used for connections.
• Use the die label (XX-YY) for correct orientation.
Copyright © 2010-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
3
CMPA801B025D Rev 1.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/rf