CMPA601C025D Datasheet, PDF (3/6 Pages) Cree, Inc – 25 W, 6.0 - 12.0 GHz, GaN MMIC, Power Amplifier

Die Dimensions (units in microns)
Overall die size 4380 x 6080 (+0/-50) microns, die thickness 100 (+/-10) microns.
All Gate and Drain pads must be wire bonded for electrical connection.
Pad Number Function
Description
Pad Size (in) Note
1
RF IN
RF-Input pad. Matched to 50 ohm. The DC impedance ~ 0 ohm due matching circuit.
150 x 200
4
2
VD1_A
Drain supply for stage 1A. VD = 28 V.
3
VD1_B
Drain supply for stage 1B. VD = 28 V.
4
VG1&2_A Gate control for stage 1&2A. VG = -2.0 to - 3.5 V.
5
VG1&2_B Gate control for stage 1&2B. VG = -2.0 to - 3.5 V.
6
VD2_A
Drain supply for stage 2A. VD = 28 V.
7
VD2_B
Drain supply for stage 2B. VD = 28 V.
8
VG3_A
Gate control for stage 3A. VG = -2.0 to - 3.5 V.
9
VG3_B
Gate control for stage 3B. VG = -2.0 to - 3.5 V.
10
VD3_A
Drain supply for stage 3A. VD = 28 V.
11
VD3_B
Drain supply for stage 3B. VD = 28 V.
12
RF-OUT
RF-Output pad. Matched to 50 ohm.
150 x 150
1
150 x 150
1
150 x 150
1,2
150 x 150
1,2
129 x 129
1
129 x 129
1
129 x 129
1,3
129 x 129
1,3
-
1
-
1
150 x 200
4
Notes:
1 _{Attach bypass capacitor to pads 2-11 per application circuit.}
2 _{VG1&2_A and VG1&2_B are connected internally so it would be enough to connect either one for proper operation.}
3 _{VG3_A and VG3_B are connected internally so it would be enough to connect either one for proper operation.}
4 _{The RF Input and Output pad have a ground-signal-ground with a nominal pitch of 10 mil (250 um). The RF ground}
pads are 100 x 100 microns.
Die Assembly Notes:
• Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at http://www.cree.com/~/media/Files/Cree/RF/Application%20Notes/Appnote%202%20Eutectic.pdf
• Vacuum collet is the preferred method of pick-up.
• The backside of the die is the Source (ground) contact.
• Die back side gold plating is 5 microns thick minimum.
• Thermosonic ball or wedge bonding are the preferred connection methods.
• Gold wire must be used for connections.
• Use the die label (XX-YY) for correct orientation.
Copyright © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective
owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
3
CMPA601C025D Rev 1.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: [phone]
Fax: [phone]
Fax: [phone]
www.cree.com/RF