CMPA2060025D Datasheet, PDF (3/7 Pages) Cree, Inc – 25 W, 2.0 - 6.0 GHz, GaN MMIC, Power Amplifier

Die Dimensions (units in microns)
Overall die size 3610 x 3670 (+0/-50) microns, die thickness 100 (+/-10) microns.
All Gate and Drain pads must be wire bonded for electrical connection.
Pad Number Function
Description
1
RF-IN RF-Input pad. Matched to 50 ohm.
2
VG1_A Gate control for stage 1. V_G ~ 2.0 - 3.5 V.
3
VG1_B Gate control for stage 1. V_G ~ 2.0 - 3.5 V.
4
VD1_A Drain supply for stage 1. V_D = 28 V.
5
VD1_B Drain supply for stage 1. V_D = 28 V.
6
VG2_A Gate control for stage 2A. V_G ~ 2.0 - 3.5 V.
7
VG2_B Gate control for stage 2B. V_G ~ 2.0 - 3.5 V.
8
VD2_A Drain supply for stage 2A. V_D = 28 V.
9
VD2_B Drain supply for stage 2B. V_D = 28 V.
10
RF-Out RF-Output pad. Requires external matching circuit for optimal performance freq. > 4.0 GHz
Pad Size
(microns)
203 x 203
152 x 127
152 x 127
228 x 152
228 x 152
178 x 178
178 x 178
–
–
203 x 203
Note
3
1,2
1,2
1
1
1
1
1
1
3
Notes:
1 _{Attach bypass capacitor to pads 2-9 per application circuit.}
2 _{The RF Input and Output pad have a ground-signal-ground with a nominal pitch of 9 mil (240 um). The RF}
ground pads are 127 x 127 microns.
Die Assembly Notes:
• Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at http://www.cree.com/products/wireless_appnotes.asp
• Vacuum collet is the preferred method of pick-up.
• The backside of the die is the Source (ground) contact.
• Die back side gold plating is 5 microns thick minimum.
• Thermosonic ball or wedge bonding are the preferred connection methods.
• Gold wire must be used for connections.
• Use the die label (XX-YY) for correct orientation.
Copyright © 2010-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
3
CMPA2060025D Rev 1.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/wireless