XP-L Datasheet, PDF (28/35 Pages) Cree, Inc – Cree XLamp XP-L LEDs

XLamp^® XP-L LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XP-L LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
T_P
T_L
Ts_max
Ts_min
ts
Preheat
Ramp-up
t_P
t_S
Critical Zone
T_L to T_P
Ramp-down
25
t 25˚C to Peak
Time
Profile Feature
Average Ramp-Up Rate (Ts_max to Tp)
Preheat: Temperature Min (Ts_min)
Preheat: Temperature Max (Ts_max)
Preheat: Time (ts_min to ts_max)
Time Maintained Above: Temperature (T_L)
Time Maintained Above: Time (t_L)
Peak/Classification Temperature (Tp)
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
IPC/JEDEC J-STD-020C
Lead-Free Solder
1.2 °C/second
120 °C
170 °C
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
20-40 seconds
1 - 6 °C/second
4 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree^® and XLamp^® are registered trademarks and the Cree logo and SC5
Technology™ are trademarks of Cree, Inc. UL^® and the UR logo are registered trademarks of UL LLC.
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