CPC5610 Datasheet, PDF (18/18 Pages) Clare, Inc. – LITELINK™ II Silicon Data Access Arrangement (DAA) IC

7.2 Tape and Reel Packaging
Figure 19. Tape and Reel Dimensions
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
6.731 MAX.
(.265)
1.753 ± .102
(.069 ± .004)
.406 MAX.
(.016)
7.493 ± .102
(.295 ± .004)
12.090
3.20
(.476)
(.126)
2.70
(.106)
2.007 ± .102 1.498 ±.102 3.987 ± .102
(.079 ± .004)(.059 ± .004) (.157 ±.004)
16.002 ± .305
(.630 ± .012)
10.693 ± .025
(.421 ± .001)
Embossed Carrier
Embossment
Top Cover _{.050R TYP.}
Tape
11.989 ± .102
(.472 ± .004)
Feed Direction
10.897 ± .025 1.549 ± .102
(.429 ± .001) (.061 ± .004)
Dimensions
mm
(inches)
7.3 Soldering
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LITELINK using IPC/JEDEC standard J-STD-020A.
Moisture uptake from atmospheric humidity occurs by
diffusion. During the solder reflow process, in which
the component is attached to the PCB, the whole body
of the component is exposed to high process tempera-
tures. The combination of moisture uptake and high
reflow soldering temperatures may lead to moisture
induced delamination and cracking of the component.
To prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-020A
per the labeled moisture sensitivity level (MSL), level
3.
7.3.2 Reflow Profile
The maximum ramp rates, dwell times, and tempera-
tures of the assembly reflow profile should not exceed
those specified in IPC/JEDEC standard J-STD-020A,
which were used to determine the moisture sensitivity
level of this component.
7.4 Washing
Clare does not recommend ultrasonic cleaning of this
part.
For additional information please visit www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC5610/CPC5611-R9.0
Copyright © 2002, Clare, Inc.
All rights reserved. Printed in USA.
6/27/2002