EP9307 Datasheet, PDF (40/48 Pages) Cirrus Logic – ARM9 SOC WITH ETHERNET USB DISPLAY AND TOUCHSCREEN

EP9307
ARM9 SOC with Ethernet, USB, Display and Touchscreen
Symbol
A
A1
A2
b
c
D
D3
E
E3
e
ddd
Table R. 272 Pin Diagram Dimensions
dimension in mm
dimension in inches
MIN
NOM
MAX
MIN
NOM
MAX
1.35
0.23
0.65
0.35
0.21
13.95
12.75
13.95
12.75
0.75
1.40
0.28
0.70
0.40
0.26
14.00
12.80
14.00
12.80
0.80
1.45
0.33
0.75
0.45
0.31
14.05
12.85
14.05
12.85
0.85
0.10
0.053
0.009
0.026
0.014
0.0083
0.549
0.502
0.549
0.502
0.030
0.055
0.011
0.028
0.016
0.0102
0.551
0.504
0.551
0.504
0.031
0.057
0.013
0.030
0.018
0.0122
0.553
0.506
0.553
0.506
0.033
0.004
Note:
1. Controlling Dimension: Millimeter.
2. Primary Datum C and seating plane are defined by the spherical crowns of the solder balls.
3. Dimension b is measured at the maximum solder ball diameter, parallel to Primary Datum C.
4. There shall be a minimum clearance of 0.25 mm between the edge of the solder ball and the body edge.
5. Reference Document: JEDEC MO-151, BAL-2
272 Pin TFBGA Pinout (Bottom View)
The following table shows the 272 pin TFBGA pinout. (For better understanding, compare the coordinates on the x and
y axis on Figure 26, "272 Pin TFBGA Pinout", on page 41 with Figure 25, "272 Pin TFBGA Diagram", on page 39.
• VDD_core is vddc.
• VDD_ring is vddr.
• GND_core is gndc.
• GND_ring is gndr.
40
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