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ZALM-301-1 Datasheet, PDF (16/19 Pages) California Eastern Labs – APEX LT SERIES TRANSCEIVER MODULES
ZALM-300 Series
PROCESSING (Continued)
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
D reference document IPC-7711.
E Rework
The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
D underneath is recommended. Avoid overheating.
N N !Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
E IG Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
M S is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
NOTFROERCNOEMW DE immunity to external RF interference.