ZALM-301-1 Datasheet, PDF (15/19 Pages) California Eastern Labs – APEX LT SERIES TRANSCEIVER MODULES

ZALM-300 Series
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
Time above TL
D _Tpeak
Time within 5º of Tpeak
E _{Time from 25º to Tpeak}
D ^{Ramp down rate}
217ºC
60-150 sec
260 + 0ºC
20-30 sec
8 min max
6ºC/sec max
Achieve the brightest possible solder fillets with a good shape and low contact angle.
N ^N _{Pb-Free Soldering Paste}
E _{IG Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.}
M _{S Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate}
IPC specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.
OM ^{DE Cleaning}
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
EC W • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
E ^{neighboring pads. Water could also damage any stickers or labels.}
R _{• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is}
N _{not accessible for post-washing inspection. The solvent could also damage any stickers or labels.}
T _{• Ultrasonic cleaning could damage the module permanently.}
O ^{R The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.}
N ^{O Optical Inspection}
F After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.