CSPEMI606 Datasheet, PDF (9/12 Pages) California Micro Devices Corp – LCD EMI Filter Array with ESD Protection

PRELIMINARY
CSPEMI606/608
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
Figure 11. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 12. Lead-free (SnAgCu) Solder
Ball Reflow Profile
L Tel: [phone] L Fax: [phone] L www.calmicro.com
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