CSPEMI606 Datasheet, PDF (11/12 Pages) California Micro Devices Corp – LCD EMI Filter Array with ESD Protection

Mechanical Details (cont’d)
CSPEMI608 Mechanical Specifications
The package dimensions for the CSPEMI608 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 3.955 4.000 4.045 0.1557 0.1575 0.1593
A2 1.413 1.458 1.503 0.0556 0.0574 0.0592
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.200 0.250 0.300 0.0079 0.0098 0.0118
C2 0.244 0.294 0.344 0.0096 0.0116 0.0135
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
PRELIMINARY
CSPEMI606/608
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
A
1234567 8
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI608 Chip Scale Package
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: [phone] L Fax: [phone] L www.calmicro.com
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