CSPEMI606 Datasheet, PDF (10/12 Pages) California Micro Devices Corp – LCD EMI Filter Array with ESD Protection

Mechanical Details
CSPEMI606/608 devices are packaged in a custom
Chip Scale Packages (CSP). Dimensions for each of
these devices are presented in the following pages.
CSPEMI606 Mechanical Specifications
The package dimensions for the CSPEMI606 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 2.915 2.960 3.005 0.1148 0.1165 0.1183
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
PRELIMINARY
CSPEMI606/608
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
123456
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI606 Chip Scale Package
© 2003 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: [phone] L Fax: [phone] L www.calmicro.com 10/10/03