CSPESD301 Datasheet, PDF (7/7 Pages) California Micro Devices Corp – 1,2 and 3-Channel ESD Arrays in CSP

CSPESD301/302/303
Mechanical Details
CSP Mechanical Specifications
CSPESD301/302/303 devices are packaged in a cus-
tom Chip Scale Package (CSP). Dimensions are
shown below. For complete information on CSP pack-
aging, see the California Micro Devices CSP Package
Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.881 0.925 0.971 0.0347 0.0365 0.0382
A2 1.015 1.060 1.105 0.0400 0.0417 0.0435
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.163 0.213 0.263 0.0064 0.0084 0.0104
C2 0.230 0.280 0.330 0.0091 0.0110 0.0130
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
SIDE
VIEW
B
A
12
0.30 DIA.
D1
63/37 Sn/Pb (Eutectic) or
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPESD301/302/303 Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CSPESD301
CSPESD302
CSPESD303
CHIP SIZE (mm)
1.06 X 0.93 X 0.6
POCKET SIZE (mm)
B₀ X A₀ X K₀
1.14 X 1.00 X 0.70
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
±^{To0l.e2ramnmce On Tape}
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 9. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
12/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: [phone] L Fax: [phone] L www.calmicro.com
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