CSPESD301 Datasheet, PDF (2/7 Pages) California Micro Devices Corp – 1,2 and 3-Channel ESD Arrays in CSP

CSPESD301/302/303
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
12
A
n*
B
BOTTOM VIEW
(Bumps Up View)
A2 A1
B2 B1
Orientation
Marking
* See ordering information for
appropriate part marking.
CSPESD301/302/303
4-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Bumps
4
4
4
Package
CSP
CSP
CSP
Standard Finish
Ordering Part
Number¹
Part Marking
CSPESD301
F
CSPESD302
G
CSPESD303
H
Lead-free Finish²
Ordering Part
Number¹
Part Marking
CSPESD301G
F
CSPESD302G
G
CSPESD303G
H
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: [phone]
L Fax: [phone] L www.calmicro.com
12/10/03