CM1205-16CP Datasheet, PDF (6/7 Pages) California Micro Devices Corp – ESD Protection Arrays, Chip Scale Package

CM1205
Mechanical Details (cont’d)
CM1205-08CS/CP 10-bump CSP Mechanical Specifications
The CM1205-08CS/CP devices are packaged in a 10-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
10
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 3.059 3.104 3.149 0.1204 0.1222 0.1240
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
5
4
3
2 BA
1
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.638 0.707 0.776 0.0251 0.0278 0.0306
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
BA
D1
0.35 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for CM1205-08CS/CP
10-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1205-08CS/CP
CHIP SIZE (mm)
3.104 X 1.154 X 0.644
POCKET SIZE (mm)
B₀ X A₀ X K₀
3.28 X 1.32 X 0.81
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY
PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 5. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: [phone]
L Fax: [phone] L www.calmicro.com
11/17/03