CM1205-16CP Datasheet, PDF (2/7 Pages) California Micro Devices Corp – ESD Protection Arrays, Chip Scale Package

CM1205
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
A
B
123
L05
Orientation
Marking
(see note 2)
A
B
TOP VIEW
(Bumps Down View)
12345
120508
Orientation
Marking
(see note 2)
A
TOP VIEW
(Bumps Down View)
12345
CM1405-04
CSP Package
CM1405-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
B1 B2 B3
A1 A2 A3
BOTTOM VIEW
(Bumps Up View)
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
BOTTOM VIEW
(Bumps Up View)
D1 D2 D3 D4 D5
B
120516
C
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
D
A1 A2 A3 A4 A5
CM1405-16
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Bumps
6
10
20
Package
CSP
CSP
CSP
Standard Finish
Ordering Part
Number¹
Part Marking
CM1205-04CS
L05
CM1205-08CS
120508
CM1205-16CS
120516
Lead-free Finish²
Ordering Part
Number¹
Part Marking
CM1205-04CP
L05
CM1205-08CP
120508
CM1205-16CP
120516
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: [phone]
L Fax: [phone] L www.calmicro.com
11/17/03