CM1205-16CP Datasheet, PDF (5/7 Pages) California Micro Devices Corp – ESD Protection Arrays, Chip Scale Package

CM1205
Mechanical Details
The CM1205 devices are packaged in custom Chip
Scale Packages (CSP).
CM1205-04CS/CP 6-bump CSP Mechanical Specifications
The CM1205-04CS/CP devices are packaged in a 6-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
6
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
Millimeters
Inches
3
Dim
Min Nom Max Min Nom Max
2
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 1.759 1.804 1.849 0.0693 0.0710 0.0728
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
B3 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
1
BA
D1
0.35 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
NOTE: DIMENSIONS IN MILLIMETERS
D1 0.638 0.707 0.776 0.0251 0.0278 0.0306
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Package Dimensions for CM1205-04CS/CP
6-bump Chip Scale Package
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CM1205-04CS/CP
CHIP SIZE (mm)
1.804 X 1.154 X
0.644
Top
Cover
Tape
K_o
POCKET SIZE (mm)
B₀ X A₀ X K₀
1.98 X 1.32 X 0.91
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
10 Pitches Cumulative
P_o
Tolerance On Tape
±0.2 mm
A_o
W
B_o
QTY
PER
REEL
3500
P₀
P₁
4mm 4mm
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: [phone] L Fax: [phone] L www.calmicro.com
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