CM1223 Datasheet, PDF (13/13 Pages) California Micro Devices Corp – Industry First Low Capacitance ESD Protection Arrays w/Backdrive Protection

Mechanical Details (cont’d)
MSOP-10 Mechanical Specifications
CM1223-04MS/MR and CM1223-08MS/MR devices
are packaged in 10-pin MSOP packages. Dimensions
are presented below.
For complete information on the MSOP-10 package,
see the California Micro Devices MSOP Package Infor-
mation document.
PACKAGE DIMENSIONS
Package
MSOP
Pins
10
Dimensions
Millimeters
Min
Max
Inches
Min
Max
A
0.75
0.95
0.028
0.038
A1
0.05
0.15
0.002
0.006
B
0.17
0.27
0.007
0.011
C
0.18
0.007
D
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
e
0.50 BSC
0.0196 BSC
H
4.80
5.00
0.187
0.197
L
0.40
0.70
0.0137 0.029
# per tape
and reel
4000
Controlling dimension: millimeters
CM1223
Mechanical Package Diagrams
TOP VIEW
D
10 9 8 7 6
H
E
Pin 1
Marking
12345
SIDE VIEW
A
SEATING
PLANE
B
A1
e
END VIEW
C
L
Package Dimensions for MSOP-10
© 2006 California Micro Devices Corp. All rights reserved.
08/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 13