BUF12800 Datasheet, PDF (17/20 Pages) Burr-Brown (TI) – REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION

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Thermal Pad Mechanical Data
PWP (R–PDSO–G24)
THERMAL INFORMATION
The PWP PowerPAD package incorporates an exposed thermal die pad that is designed to be attached directly
to an external heat sink. When the thermal die pad is soldered directly to the printed circuit board (PCB), the PCB
can be used as a heatsink. In addition, through the use of thermal vias, the thermal die pad can be attached directly
to a ground plane or special heat sink structure designed into the PCB. This design optimizes the heat transfer from
the integrated circuit (IC).
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to
Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and
Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004. Both documents are available
at www.ti.com. See Figure 19 for PWP package exposed thermal die pad dimensions.
24
1
Exposed Thermal
Die Pad
5,16
4,10
13
12
2,40
1,65
Bottom View
NOTE: All linear dimensions are in millimeters.
PPTD030
Figure 19. PWP Package Exposed Thermal Die Pad Dimensions
PowerPAD is a trademark of Texas Instruments.
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