SA72SB0 Datasheet, PDF (3/7 Pages) Bourns Electronic Solutions – Breaker (Surface Mount Thermal Cutoff Device)

SA Series Breaker (Surface Mount Thermal Cutoff Device)
Surface Mount Recommendations
The Model SA Series breaker is designed for reflow and hand soldering. It is not designed or warranted for flow soldering. The following
conditions must be adhered to:
Reflow Soldering:
The recommended reflow soldering
conditions are as follows:
150 ~ 180 °C................ 100 ~ 150 seconds
≤220 °C........................ 20 ~ 40 seconds
255 ~ 260 °C................ 5 ~ 10 seconds
Process breaker in a reflow furnace using
the profile shown above three times,
followed by positioning the breaker in
ambient temperature of +25 °C for 8 hours.
Hand Soldering:
Place a solder iron on each of the terminal
ends for 5 seconds at +350 °C, followed by
positioning the breaker in ambient
temperature of +25 °C for 8 hours.
270
240
210
180
150
120
90
60
30
0
0
Recommended Reflow Profile
TEMPERATURE
_ TIME
150 ~ 180 °C ..... 100 ~ 150 Seconds
≤220 °C ..... 20 ~ 40 Seconds
245 °C ..... Peak
60
120 180 240
300 360
Time (Seconds)
Do not expose the breaker to temperatures exceeding +260 °C.
Recommended Land Pattern
0.6
(.024)
0.9
(.035)
1.6
(.063)
2.4
(.094)
0.9
(.035)
9.0
(.354)
5.8
(.228)
1.6
(.063)
Recommended Mask Thickness: 0.12 mm
Recommended Solder Particle Size: 30 µm
DIMENSIONS:
MM
(INCHES)
Mounting Cautions
In order to protect the housing and mechanical parts inside from deformation, prevent excessive load at the time of part absorption / part
deployment and mounting. A part absorption nozzle more than 2 mm in diameter with a 3 N (5 N max.) mounting load is recommended. Any
shock to the product by the nozzle during the mounting procedure may have a negative influence on the function of the breaker.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.