2SC2712_07 Datasheet, PDF (4/4 Pages) Toshiba Semiconductor – Silicon NPN Epitaxial Type (PCT process)

BL Galaxy Electrical
Silicon Epitaxial Planar Transistor
PACKAGE OUTLINE
Plastic surface mounted package
SOLDERING FOOTPRINT
Production specification
2SC2712
SOT-23
SOT-23
Dim
Min
Max
A
2.85
2.95
B
1.25
1.35
C
1.0Typical
D
0.37
0.43
E
0.35
0.48
G
1.85
1.95
H
0.02
0.1
J
0.1Typical
K
2.35
2.45
All Dimensions in mm
Unit : mm
PACKAGE INFORMATION
Device Package
Shipping
2SC2712 SOT-23
3000/Tape&Reel
Document number: BL/SSSTC021
Rev.A
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