BCF080T Datasheet, PDF (5/6 Pages) BeRex Corporation – HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP

Wire Bonding Options
BCF060T
ㆍ Gold Bonding Wire information
1. Gate to input transmission line
- Length and Height : 400 um and 250 um
- Number of wires: 1
2. Drain to output transmission line
- Length and Height : 350 um and 250 um
- Number of wires: 1
3. Source to ground plate
- Length and Height : 200 um x 250 um
- Number of wires: 4
Note: The diameter of bonding wires: 1 mil
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BeRex, Inc. 3350 Scott Blvd. #61-01 Santa Clara, CA 95054 tel. [phone]
Specifications are subject to change without notice. ©BeRex 2015
January 2015
Rev. 1.3