BCL016B_16 Datasheet, PDF (4/5 Pages) BeRex Corporation – SUPER LOW NOISE PHEMT CHIP

P_IN_P_OUT/Gain, PAE (12 GHz)
BCL016B
Frequency = 12GHz
V_DS = 2 V, I_DS = 10 mA
WIRE BONDING INFORMATION
Always follow wire bonding diagrams recommended by BeRex for each device to achieve optimum device
performance and reliability. As a general rule, bonding temperature should be kept to a maximum of 280°C for no
longer than 2 minutes for all bonding wires.
Using 1 mil. Diameter, Au bonding wires.
1. Gate to input transmission line
- Length and Height : 500 µm x 250 µm
- Number of wire(s): 1
2. Drain to output transmission line
- Length and Height : 500 µm x 250 µm
- Number of wire(s) : 1
3. Source to ground plate
- Length and Height : 350 µm x 200 µm
- Number of wire(s) : 4
BeRex
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Rev. 2.1 A
PRELIMINARY