BCL016B_16 Datasheet, PDF (2/5 Pages) BeRex Corporation – SUPER LOW NOISE PHEMT CHIP

BCL016B
MAXIMUM RATING (T_a = 25°C)
SYMBOLS
V_DS
V_GS
I_DS
I_GSF
P_IN
T_CH
T_STG
P_T
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Forward Gate Current
Input Power
Channel Temperature
Storage Temperature
Total Power Dissipation
ABSOLUTE MAX.
5V
-3 V
50 mA
30 mA
20 dBm
150° C
-60°C - 150°C
200 mW
Exceeding any of the above Maximum Ratings will result in reduced MTTF and may cause permanent damage to the device.
S-PARAMETERS (V_ds = 2 V, I_ds = 10 mA)
FREQUENCY
[GHz]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
S11
[MAG]
0.99
0.98
0.97
0.95
0.93
0.91
0.88
0.85
0.82
0.78
0.74
0.68
0.66
0.63
0.64
0.66
0.69
0.73
0.76
0.80
0.82
0.84
0.86
0.89
0.91
0.93
S11
[Ang]
-11.25
-22.22
-32.54
-44.55
-54.26
-65.76
-79.02
-90.99
-101.41
-116.54
-131.03
-150.07
-169.47
168.75
145.31
124.37
102.63
88.34
75.06
59.85
52.72
42.62
35.06
32.73
24.09
19.10
S21
[MAG]
5.95
5.93
5.68
5.73
5.52
5.59
5.45
5.42
5.31
5.22
5.13
5.00
4.69
4.46
4.10
3.70
3.30
2.85
2.48
2.12
1.80
1.52
1.23
1.04
0.86
0.69
S21
[Ang]
169.63
160.06
151.26
142.08
133.35
124.70
114.83
106.08
97.75
87.78
78.33
66.81
56.28
45.46
33.81
23.23
11.86
3.09
-5.82
-15.00
-21.27
-28.44
-34.89
-38.66
-43.76
-48.13
S12
[MAG]
0.017
0.033
0.048
0.062
0.076
0.089
0.101
0.113
0.125
0.133
0.143
0.151
0.153
0.157
0.154
0.148
0.141
0.130
0.120
0.109
0.100
0.093
0.084
0.076
0.062
0.054
S12
[Ang]
83.73
76.58
70.53
64.57
58.37
53.16
45.48
40.18
33.41
26.50
19.24
10.38
2.15
-6.54
-16.06
-24.06
-32.66
-38.61
-43.78
-48.60
-50.84
-53.53
-57.23
-60.50
-61.13
-60.20
S22
[MAG]
0.54
0.53
0.51
0.48
0.44
0.40
0.33
0.28
0.23
0.15
0.11
0.13
0.18
0.26
0.36
0.44
0.51
0.57
0.62
0.65
0.67
0.69
0.71
0.73
0.76
0.77
S22
[Ang]
-5.90
-11.65
-17.14
-21.53
-27.50
-32.21
-42.00
-45.56
-58.00
-73.89
-103.09
-157.16
164.27
148.69
135.43
126.12
119.95
111.43
106.03
101.91
98.55
96.42
92.69
90.55
89.32
88.42
NOTE: S-parameters include 12 mil gold bond wires: 1 gate wire, 1 drain wire, 4 source wires. Reference planes are at the edge of substrates
shown in the “Wire Bonding Information”.
BeRex
●website: www.berex.com
●email: [e-mail]
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2016 BeRex
Rev. 2.1 A
PRELIMINARY