SLIN-30E1AX Datasheet, PDF (25/26 Pages) Bel Fuse Inc. – 6.0 Vdc - 14 Vdc Input, 0.8 Vdc - 2.75 Vdc /30 A Outputs

NON-ISOLATED DC/DC CONVERTERS
6.0 Vdc - 14 Vdc Input, 0.8 Vdc - 2.75 Vdc /30 A Outputs
Jan. 11, 2010
Bel Power Inc., a subsidiary of Bel Fuse Inc.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This
standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the
package. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown below.
300
P eak Temp 235^oC
2 50
Co o ling
Heat zo ne
200
max 4^oCs^-1
zo ne
1-4^oCs^-1
150
So ak zo ne
10 0
30-240s
T_lim above
205^oC
50
P reheat zo ne
max 4^oCs^-1
0
REFLOW TIME (S)
Reflow Profile for Tin/Lead (Sn/Pb) process
240
235
230
225
220
215
210
205
200
0
10
20
30
40
50
60
Time Limit Curve Above 205^oC Reflow for Tin
Lead (Sn/Pb) process
MSL Rating
The SLIN-30E1Ax modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the
product at conditions of <= 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly.
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302 • Tel [phone] • Fax [phone] • www.belfuse.com
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