SLIN-30E1AX Datasheet, PDF (24/26 Pages) Bel Fuse Inc. – 6.0 Vdc - 14 Vdc Input, 0.8 Vdc - 2.75 Vdc /30 A Outputs

NON-ISOLATED DC/DC CONVERTERS
6.0 Vdc - 14 Vdc Input, 0.8 Vdc - 2.75 Vdc /30 A Outputs
Jan. 11, 2010
Bel Power Inc., a subsidiary of Bel Fuse Inc.
Surface Mount Information
Pick and Place
The SLIN-30E1Ax modules use an open frame construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface mount processing, as well as safety standards, and
is able to withstand reflow temperatures of up to 300^oC. The label also carries product information such as part
number and serial number.
Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules
have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size,
tip style, vacuum pressure and pick & placement speed should be considered to optimize this process. The
minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer
diameter, which will safely fit within the allowable component spacing, is 5 mm max.
Tin Lead Soldering
The SLIN-30E1Ax power modules are lead free modules and can be soldered either in a lead-free solder process
or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order
to customize the solder reflow profile for each application board assembly. The following instructions must be
observed when soldering these units. Failure to observe these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235^oC.
Typically, the eutectic solder melts at 183^oC, wets the land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR.
For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The SLIN-30E1Ax modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions may result in the
failure of or cause damage to the modules and can adversely affect long-term reliability.
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302 • Tel [phone] • Fax [phone] • www.belfuse.com
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