SLAN-03D2A0 Datasheet, PDF (23/25 Pages) Bel Fuse Inc. – NON-ISOLATED DC/DC CONVERTERS

NON-ISOLATED DC/DC CONVERTERS
3 Vdc – 14.4 Vdc Input, 0.6 Vdc - 5.5 Vdc /3 A Outputs
Mar. 16, 2012
Bel Power Inc., a subsidiary of Bel Fuse Inc.
Surface Mount Information
Pick and Place
The SLAN-03D2Ax modules use an open frame construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface mount processing, as well as safety standards, and
is able to withstand reflow temperatures of up to 300^oC.The label also carries product information such as
product code, serial number and the location of manufacture.
Nozzle Recommendations
The weight has been kept to a minimum by using open frame construction. Variables such as nozzle size, tip
style, vacuum pressure and placement speed should be considered to optimize this process. The minimum
recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is
attempted, components may fall off the module during the second reflow process.
Lead Free Soldering
The SLAN-03D2Ax modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can adversely affect long-term reliability.
.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This
standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the
package (table 5-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). For questions regarding LGA,
solder volume; please contact Bel Power for special manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 48. Soldering outside of the
recommended profile requires testing to verify results and performance.
It is recommended that the pad layout include a test pad where the output pin is in the ground plane. The thermocouple
should be attached to this test pad since this will be the coolest solder joints. The temperature of this point should be:
Maximum peak temperature is 260 C.
Minimum temperature is 235 C.
Dwell time above 217 C: 60 seconds minimum.
Dwell time above 235 C: 5 to 15 second.
MSL Rating
The SLAN-03D2Ax modules have a MSL rating of 2.
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302  Tel [phone]  Fax [phone]  www.belfuse.com
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