SM015A100JAN120 Datasheet, PDF (77/112 Pages) AVX Corporation – AVX Advanced Ceramic Capacitors for Power Supply, High Voltage and Tip and Ring Applications

Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Termination Type
Solder
Tin/Lead/Silver
Solder
Temp. °C
Immersion Time
Seconds
Nickel Barrier
60/40/0 260 ± 5
30 ± 1
Recommended Soldering Profiles
Reflow
300
Preheat
250
Natural
Cooling
200
150
220°C
to
250°C
100
50
0
1min
1min 10 sec. max
(Minimize soldering time)
Lead-Free Reflow Profile
300
250
200
150
100
50
0
0
50
100
150
200
250
300
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Time (s)
Wave
300
250
Preheat
Natural
Cooling
200
T
150
100
230°C
to
250°C
50
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other para-
meters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration and
skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
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