SM015A100JAN120 Datasheet, PDF (76/112 Pages) AVX Corporation – AVX Advanced Ceramic Capacitors for Power Supply, High Voltage and Tip and Ring Applications

Surface Mounting Guide
Recommended Soldering Profiles
REFLOW SOLDER PROFILES
275
AVX RoHS compliant products utilize termination
250
finishes (e.g.Sn or SnAg) that are compatible
225
with all Pb-Free soldering systems and are fully
reverse compatible with SnPb soldering systems.
200
Recommended Reflow Profiles
Maximum Reflow Profile With Care
Recommended Pb-Free Reflow Profile
PPrerehehaetat ^{Recommended SnPb Reflow Profile}
ReRfloewflow CooCl Doowl Dn own
A recommended SnPb profile is shown for com-
175
parison; for Pb-Free soldering, IPC/JEDECJ-STD-
150
020C may be referenced. The upper line in the
125
chart shows the maximum envelope to which
100
products are qualified (typically 3x reflow cycles
75
at 260ºC max). The center line gives the
recommended profile for optimum wettability and
50
Preheat
Reflow Cool Down
soldering in Pb-Free Systems.
25
0
20 40 60
80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Preheat:
Time / secs
The pre-heat stabilizes the part and reduces the temperature
differential prior to reflow. The initial ramp to 125ºC may be
rapid, but from that point (2-3)ºC/sec is recommended to
allow ceramic parts to heat uniformly and plastic
Wetting Force at 2nd Sec. (higher is better)
0.40
0.30
0.20
encapsulated parts to stabilize through the glass transition
0.10
temperature of the body (~ 180ºC).
0.00
-0.10
SnPb - Sn60Pb40
Sn - Sn60Pb40
Sn-Sn3.5Ag0.7Cu
Sn-Sn2.5Ag1Bi0.5Cu
Reflow:
-0.20
Sn-Sn0.7Cu
In the reflow phase, the maximum recommended time
> 230ºC is 40secs. Time at peak reflow is 10secs max.;
optimum reflow is achieved at 250ºC, (see wetting balance
chart opposite) but products are qualified to 260ºC max.
-0.30
-0.40
200 210 220 230 240 250 260 270
Temperature of Solder [C]
Please reference individual product datasheets for
maximum limits
IMPORTANT NOTE: Typical Pb-Free reflow solders have a
more dull and grainy appearance compared to traditional
Cool Down:
Cool down should not be forced and 6ºC/sec is recom-
mended. A slow cool down will result in a finer grain
SnPb. Elevating the reflow temperature will not change this,
but extending the cool down can help improve the visual
appearance of the joint.
structure of the reflow solder in the solder fillet.
WAVE SOLDER PROFILES
For wave solder, there is no change in the recommended
wave profile; all standard Pb-Free (SnCu/SnCuAg) systems
operate at the same 260ºC max recommended for SnPb
systems.
Preheat:
This is more important for wave solder; a higher temperature
preheat will reduce the thermal shock to SMD parts that are
immersed (please consult individual product data sheets for
SMD parts that are suited to wave solder). SMD parts should
ideally be heated from the bottom-Side prior to wave.
PTH (Pin through hole) parts on the topside should not be
separately heated.
Wave:
250ºC – 260ºC recommended for optimum solderability.
Cool Down:
As with reflow solder, cool down should not be forced and
6ºC/sec is recommended. Any air knives at the end of the
2nd wave should be heated.
Recommended Soldering Profiles
275
225
Wave
175
Preheat
Cool Down
125
Wave
Wave
75
Preheat
Cool Down
Preheat
Cool Down
25
0
50 100 150 200 250 300 350 400
Time / seconds
75