L06036R8CGSTR Datasheet, PDF (5/5 Pages) AVX Corporation – SMD High-Q RF Inductor

Accu-L^® 0805
Application Notes
HANDLING
SMD chips should be handled with care to avoid damage or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
CIRCUIT BOARD TYPE
HAND SOLDERING & REWORK
2
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
For other circuit board materials, please consult factory.
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
COMPONENT PAD DESIGN
time at temperature is 1 minute. When hand soldering, the
base side (white side) must be soldered to the board.
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible
COOLING
After soldering, the assembly should preferably be allowed to
cool naturally. In the event of assisted cooling, similar condi-
tions to those recommended for preheating should be used.
to decrease this to as low as 85% of component width
but it is not advisable to go below this.
CLEANING RECOMMENDATIONS
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
Pad extension about 0.8mm for wave soldering.
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
1.30
(0.051)
3.1
(0.122) _0.50
(0.020)
1.30
(0.051)
1.2
(0.047)
3.8
1.4
(0.150) (0.055)
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space beneath
the device. Such residues may otherwise become conduc-
tive and effectively offer a lossy bypass to the device. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
Ultrasonic conditions . . power – 20w/liter max.
frequency – 20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
0603
0.8
(0.031)
Accu-L^®
1.2
(0.047)
1.5
(0.059)
0805
Accu-L^®
Time. . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
0.90
(0.035)
2.3
(0.091) _0.50
(0.020)
0.90
(0.035)
0.8
(0.031)
0.7
(0.028)
0603
Accu-L^®
2.8 1.4
(0.110) (0.055)
0.7
(0.028)
1.5
(0.059)
0805
Accu-L^®
Recommended storage conditions for Accu-L^® prior to use
are as follows:
Temperature. . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED SOLDERING
PROFILE
For recommended soldering profile see page 23
32