HCPL-2300-000E Datasheet, PDF (5/14 Pages) AVAGO TECHNOLOGIES LIMITED – 8 MBd Low Input Current Optocoupler

Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-2300 has been approved by the following or-
ganizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-5
Maximum Working Insulation Voltage V_IORM = 630V_peak
(Option 060 only)
Note: Non-halide flux should be used.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol Value
L(IO1) 7.1
L(IO2) 7.4
0.08
CTI
175
IIIa
Units
mm
mm
mm
V
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
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