HCPL-0738-500E Datasheet, PDF (4/8 Pages) AVAGO TECHNOLOGIES LIMITED – High Speed CMOS Optocoupler

Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
UL
Recognized under UL 1577,
component recognition program,
File E55361.
Insulation and Safety Related Specifications (approval pending)
Parameter
Symbol Value Units
Minimum External Air Gap
(Clearance)
L(I01)
4.9
mm
Minimum External Tracking
(Creepage)
L(I02)
4.8
mm
Minimum Internal Plastic Gap
(Internal Clearance)
0.08 mm
Tracking Resistance
(Comparative Tracking Index)
CTI
≥ 175 Volts
Isolation Group
IIIa
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 only)
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector; also
known as distance through insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board
to achieve desired creepage and clearances. Creepage
and clearance distances will also change depending on
factors such as pollution degree and insulation level.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Output Voltage
Average Forward Input Current
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Minimum
Maximum
Units
T_S
–55
125
˚C
T_A
–40
100
˚C
V_DD
0
6.0
Volts
V_O
–0.5
V_DD + 0.5
Volts
I_F
—
20
mA
I_O
—
2
mA
260˚C for 10 seconds, 1.6 mm below seating plane
See Solder Reflow Thermal Profile section
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
Symbol
T_A
V_DD
I_F
Minimum
Maximum
Units
–40
100
˚C
4.5
5.5
V
10
16
mA