HCPL-643X Datasheet, PDF (3/12 Pages) AVAGO TECHNOLOGIES LIMITED – Hermetically Sealed, Very High Speed, Logic Gate Optocouplers High radiation immunity

Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
20 Pad LCCC
Surface Mount
2 Channels
1
VCC 8
2
VE ₇
3
6
VO
4
GND ⁵
1
VCC 8
VO1
2
7
VO2
3
6
4
GND ⁵
15
VCC2
19
VO2
13
20
GND2 ¹²
2
VO1 ^VCC1 10
3
GND1
78
Note:
All DIP devices have common V_CC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate V_CC and ground
connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
Note: Dimensions in millimeters (inches).
Solder thickness 0.127 (0.005) max.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
2.29 (0.090)
2.79 (0.110)
3
0.51 (0.020)
MAX.
Note: Dimensions in millimeters (inches).
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)