IAM-91563 Datasheet, PDF (2/14 Pages) Agilent(Hewlett-Packard) – 0.8-6 GHz 3V Downconverter

IAM-91563 Absolute Maximum Ratings

Symbol Parameter
Units
Absolute
Maximum^[1]
V_d
V_RF, V_LO
P_in
T_ch
T_STG
Device Voltage, RF output to ground
RF voltage or LO voltage to ground
CW RF Input Power
Channel Temperature
Storage Temperature
V
6.0
V
+0.5, -1.0
dBm
+13
°C 150
°C
-65 to 150
Thermal Resistance ^[2]: θ_ch-c = 310°C/W
Notes:
1. Permanent damage may occur if any of
these limits are exceeded.
2. TC = 25°C (TC is defined to be the
temperature at the package pins where
contact is made to the circuit board).
IAM-91563 Electrical Specifications, T_C = 25°C, V_d = 3 V
Symbol Parameters and Test Conditions
Units Min. Typ. Max. Std Dev^[2]
G_test
Gain in test circuit^[1]
RF=1890 MHz, IF=250 MHz dB 4.0 9.0
NF_test Noise Figure in test circuit^[1]
RF=1890 MHz, IF=250 MHz dB 8.5 11.0
I_d
Device Current mA 6.0 9.0 12.0
NF
Noise Figure (RF & IF with external matching,
IF=250 MHz, LO power=-5 dBm)



f = 0.9 GHz dB 7.0
f = 1.9 GHz 8.5
0.5
f = 2.4 GHz 11.0
f = 4.0 GHz 16.5
f = 6.0 GHz 18.0
G_c
Conversion gain (RF and IF with external matching,
IF=250 MHz, LO power=-5 dBm)



f = 0.9 GHz dB 11.0
f = 1.9 GHz 9.0 1.5
f = 2.4 GHz 7.7
f = 4.0 GHz 4.6
f = 6.0 GHz 1.7
P_{1 dB}
Output power @ 1 dB compression (RF and IF with
external matching, IF=250 MHz, LO power =-5 dBm)



f = 0.9 GHz dBm
f = 1.9 GHz
f = 2.4 GHz
f = 4.0 GHz
f = 6.0 GHz
-6.7
-8.0 1.3
-8.7
-15.0
-17.8
RL_RF
RF port return loss
f = 0.5 - 6.0 GHz dB -1.7
0.2
RL_LO
LO port return loss
f = 0.5 - 6.0 GHz dB -9.4
0.3
RL_IF
IF port return loss
f = 50 - 700 MHz dB -3.7
0.2
IP₃
Input Third Order Intercept Point
RF = 1.9 GHz, IF = 250 MHz dBm -6.0 1.3
I_d = 9.0 mA, LO power = -5 dBm
IP₃
Input Third Order Intercept Point
RF = 1.9 GHz, IF = 250 MHz dBm
0 1.1
I_d = 15 mA, LO power = -2 dBm
ISOL_L-R LO-RF Isolation
RF = 1.9 GHz dB 18
ISOL_R-I RF-IF Isolation (No Match) dB 2
ISOL_R-I LO-IF Isolation (No Match) dB
4
Notes:
1. Guaranteed specifications are 100% tested in the circuit in Figure 18 in the Applications Information section.
2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the initial characterization
of this product, and is intended to be used as an estimate for distribution of the typical specification.