5962-9314002HPA Datasheet, PDF (1/11 Pages) AVAGO TECHNOLOGIES LIMITED – 90 V/1.0 Ohm, Hermetically Sealed, Power MOSFET Optocoupler

HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E
5962-93140
90 V/1.0 Ω, Hermetically Sealed, Power MOSFET Optocoupler
Data Sheet
Description
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and
SMD 5962-93140 are single channel power MOSFET opto-
couplers, constructed in eight-pin, hermetic, dual-in-line,
ceramic packages. The devices operate exactly like a solid-
state relay.
The products are capable of operation and storage over
the full military temperature range and may be pur-
chased as a standard product (HSSR-7110), with full MIL-
PRF-38534 Class H testing (HSSR-7111 and HSSR- 7112),
with MIL-PRF-38534 Class E testing (Class K with excep-
tions) (HSSR-711E) or from the DLA Standard Microcircuit
Drawing (SMD) 5962-93140. Details of the Class E program
may be found on page 11 of this datasheet.
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
1 NC
I_F
I_O
8+
+2
V_F
-3
7
V_O
6
4 NC
5-
CONNECTION B
DC CONNECTION
I_O
1 NC
8
+
I_F
+2
V_O
7
-
V_F
-3
6
4 NC
5
TRUTH TABLE
INPUT OUTPUT
H
CLOSED
L
OPEN
Features
 Dual Marked with Device Part Number and DLA
Standard Microcircuit Drawing
 ac/dc Signal &Power Switching
 Compact Solid-State Bidirectional Switch
 Manufactured and Tested on a MIL-PRF-38534Certified
Line
 QML-38534
 MIL-PRF-38534 Class H
 Modified Space Level Processing Available (Class E)
 Hermetically Sealed 8-Pin Dual In-Line Package
 Small Size and Weight
 Performance Guaranteed over -55°C to 125°C
 Connection A0.8 A, 1.0 Ω
 Connection B1.6 A, 0.25 Ω
 1500 Vdc Withstand Test Voltage
 High Transient Immunity
 5 Amp Output Surge Current
Applications
 Military and Space
 High Reliability Systems
 Standard 28 Vdc and 48 Vdc Load Driver
 Standard 24 Vac Load Driver
 Aircraft Controls
 ac/dc Electromechanical and Solid State Relay
Replacement
 I/O Modules
 Harsh Industrial Environments
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.