PC7457 Datasheet, PDF (44/66 Pages) ATMEL Corporation – PowerPC 7457 RISC Microprocessor

Substrate Capacitors for the PC7447, 360 CBGA
Figure 26 shows the connectivity of the substrate capacitor pads for the PC7447, 360 CBGA. All capacitors are 100 nF.
Figure 26. Substrate Bypass Capacitors for the PC7447, 360 CBGA
A1 CORNER
C1-1 C2-1 C3-1 C4-1 C5-1 C6-1
C1-2 C2-2 C3-2 C4-2 C5-2 C6-2
C18-2 C17-2 C16-2 C15-2 C14-2 C13-2
C18-1 C17-1 C16-1 C15-1 C14-1 C13-1
Capacitor
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
C23
C24
Pad Number
-1
-2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VDD
VDD
OVDD
VDD
VDD
VDD
VDD
VDD
OVDD
VDD
VDD
VDD
VDD
VDD
VDD
OVDD
VDD
OVDD
VDD
VDD
OVDD
VDD
VDD
VDD
Package Parameters for
the PC7457, 483 CBGA
The package parameters are as provided in the following list. The package type is
29 × 29 mm, 483-lead ceramic ball grid array (CBGA).
Package outline
29 mm × 29 mm
Interconnects
483 (22 × 22 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
–
Maximum module height
3.22 mm
Ball diameter
0.89 mm (35 mil)
44 PC7457/47 [Preliminary]
5345B–HIREL–02/04