AT24C16C-SSHM-T Datasheet, PDF (15/24 Pages) ATMEL Corporation – Two-wire Serial Electrically Erasable and Programmable Read-only Memory

Atmel AT24C16C
9. Ordering Codes
Atmel AT24C16C Ordering Information
Ordering Codes
AT24C16C-PUM (Bulk Form Only)
AT24C16C-SSHM-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C16C-SSHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C16C-XHM-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C16C-XHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C16C-MAHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C16C-MEHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C16C-STUM-T⁽²⁾ (matte Sn)
AT24C16C-CUM-T⁽²⁾ (matte Sn)
Voltage
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
Package
8P3
8S1
8S1
8A2
8A2
8Y6
8ME1
5TS1
8U3-1
Operating Range
Lead-Free/Halogen-Free
Industrial Temperature
(-40°C to 85°C)
AT24C16C-WWU11M⁽³⁾
1.7 to 5.5
Die Sales
Industrial Temperature
(-40°C to 85°C)
Notes:
1. "-B" denotes bulk delivery
2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23, and VFBGA = 5K/reel
3. For Wafer sales, please contact Atmel Sales
8P3
8S1
8A2
8Y6
8ME1
5TS1
8U3-1
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN)
8-lead, 1.80mm x 2.20mm Body, (XDFN)
5-lead, 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT-23)
8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
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8719A–SEEPR–9/10