X3C25P1-02S Datasheet, PDF (15/18 Pages) Anaren Microwave – Tight Amplitude Balance

`
Model X3C25P1-02S
Rev B
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering methods.
Manual soldering with conventional irons should be avoided.
Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can be
placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.069 gram
coupler.
Figure 3: Component Placement
Figure 5 – Low Temperature Solder Reflow Thermal Profile
Figure 4: Mounting Features Example
Figure 6 – High Temperature Solder Reflow Thermal Profile
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
[phone]
[phone]
[phone]