AMIS-721250 Datasheet, PDF (4/12 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-721250: Contact Image Sensor
Data Sheet
4.2 Bonding Pad Layout Diagram
Figure 2 shows the bonding pad locations for the AMIS-721250 sensor.
14560µm
425µm
Y
SI
GBST CLK
SIC
SC VDD
VOUT VSS
VR
SO
X
X
Pad Location Table
Pad
Location
Y
SI
Start Pulse
30
GBST Global Start Pulse
30
CLK ^Clock
30
SIC
Start Input Control
30
SC
Switch Control
30
VDD Power Supply
34
VOUT Video Output Voltage
30
VSS Ground
34
VREF Reference Voltage
30
SO
End of Scan Pulse
30
X
1000
3442
4199
4590
4945
5414
5820
10549
10909
13259
Notes:
1. The drawing is not to scale.
2. The die length and width are given
in the above sensor die figure
3. Pad locations are listed in the Pad Location Table
eg. Y
SI GBST
X
X
4. Each pad is 120 x 80um
5. All dimensions are in um
6. Die size does not include the scribe line
Figure 2: AMIS-721250 Bonding Pad Layout
AMI Semiconductor – Dec. 05, M-20496-004
4
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