AMIS-30623 Datasheet, PDF (4/67 Pages) AMI SEMICONDUCTOR – LIN Microstepping Motordriver

AMIS-30623 LIN Microstepping Motordriver
Data Sheet
15.3.8. Motor Shutdown Mode .......................................................................................................................................................... 38
15.4 Motion detection............................................................................................................................................................................ 39
16.0 Lin Controller .................................................................................................................................................................................... 42
16.1 General Description ...................................................................................................................................................................... 42
16.2 Slave Operational Range for Proper Self Synchronization ........................................................................................................... 42
16.3 Functional Description .................................................................................................................................................................. 43
16.3.1. Analog Part............................................................................................................................................................................ 43
16.3.2. Protocol Handler.................................................................................................................................................................... 43
16.3.3. Electro Magnetic Compatibility .............................................................................................................................................. 43
16.4 Error Status Register .................................................................................................................................................................... 43
16.5 Physical Address of the Circuit ..................................................................................................................................................... 43
16.6 LIN Frames ................................................................................................................................................................................... 44
16.6.1. Writing frames ....................................................................................................................................................................... 44
16.6.2. Reading frames ..................................................................................................................................................................... 45
16.6.3. Preparing frames................................................................................................................................................................... 45
16.6.4. Dynamic assignment of Identifiers......................................................................................................................................... 46
16.7 Commands table........................................................................................................................................................................... 47
16.8 LIN lost behavior ........................................................................................................................................................................... 47
16.8.1. Introduction............................................................................................................................................................................ 47
16.8.2. Sleep enable ......................................................................................................................................................................... 47
16.8.3. Fail Safe Motion .................................................................................................................................................................... 48
16.8.4. Autonomous motion .............................................................................................................................................................. 48
17.0 LIN Application Commands .............................................................................................................................................................. 51
17.1 Introduction ................................................................................................................................................................................... 51
17.2 Application Commands ................................................................................................................................................................. 52
18.0 Resistance to Electrical and Electromagnetic Disturbances............................................................................................................. 63
18.1 Electrostatic Discharges ............................................................................................................................................................... 63
18.2 Electrical transient conduction along supply lines ......................................................................................................................... 63
18.3 EMC.............................................................................................................................................................................................. 63
18.4 Power Supply Micro-interruptions ................................................................................................................................................. 63
19.0 Package Outline ............................................................................................................................................................................... 64
19.1 SOIC-20: Plastic small outline; 20 leads; body width 300mil.
AMIS reference: SOIC300 20 300G ................................. 64
19.2 NQFP-32: No lead Quad Flat Pack; 32 pins; body size 7 x 7 mm. AMIS reference: NQFP-32.............................................. 65
20.0 Soldering .......................................................................................................................................................................................... 66
20.1 Introduction to Soldering Surface Mount Packages ...................................................................................................................... 66
20.2 Re-flow Soldering.......................................................................................................................................................................... 66
20.3 Wave Soldering............................................................................................................................................................................. 66
20.4 Manual Soldering .......................................................................................................................................................................... 66
21.0 Company or Product Inquiries .......................................................................................................................................................... 67
22.0 Document History ............................................................................................................................................................................. 67
AMI Semiconductor – June 2006, Rev 3.0
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