PI3041A Datasheet, PDF (3/18 Pages) AMI SEMICONDUCTOR – Contact Image Sensor 300DPI CIS Sensor Chip

Preliminary PI3041A datasheet
Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows image sensor’s die dimension and the bonding pad locations for PI3041A Sensor Chip. The location is
referenced to the lower left corner of the die.
Figure 2. Bonding Pad and Chip Layout:
Page 3 of 18 Date: 09/23/05