AMIS-30521 Datasheet, PDF (3/26 Pages) AMI SEMICONDUCTOR – Micro-stepping Motor Driver

AMIS-30521 Micro-stepping Motor Driver
Data Sheet
GND 1
DI ²
CLK ³
NXT 4
DIR ⁵
ERR ⁶
SLA ⁷
8
32 31 30 29 28 27 26 25
AMIS-30521
24 GND
23 GND
22 _MOTXN
21 _MOTXN
20 _MOTYN
19 _MOTYN
18 _GND
17 GND
9 10 11 12 13 14 15 16
PC20070309.2
Figure 2: Pin Out AMIS-30521
5.1 Package Thermal Characteristics
The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package
partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away
from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 3: PCB Ground Plane
Layout Condition, the thermal resistance junction – to – ambient can be brought down to a level of 30°C/W.
NQFP-32
PC20041128.2
Figure 3: PCB Ground Plane Layout Condition
AMI Semiconductor – June 2007, M-20683-001
3
www.amis.com