AMIS-40615 Datasheet, PDF (16/17 Pages) AMI SEMICONDUCTOR – LIN Transceiver with 3.3V Voltage Regulator

AMIS-40615
LIN Transceiver with 3.3V Voltage Regulator
Data Sheet
Table 13: Soldering Process
Package
Wave
Soldering Method
Re-flow ⁽¹⁾
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC ⁽³⁾, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Not suitable
Not suitable ⁽²⁾
Suitable
Not recommended ⁽³⁾⁽⁴⁾
Not recommended ⁽⁵⁾
Suitable
Suitable
Suitable
Suitable
Suitable
Notes:
1. All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
dry pack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the PCB and heat sink (at bottom version) can not be achieved, and as solder may
stick to the heat sink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
11.0 Revision History
Table 14: Revision History
Revision
Date
1.0
28 April 2006
1.1
9 May 2006
1.2
23 June 2006
1.3
8 August 2006
1.4
13 December 2006
1.5
14 December 2006
1.6
18 January 2007
1.7
6 March 2007
Format
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Description
Initial document
Updated absolute maximum ratings
ƒ updated parameters – Vcc, WAKE, INH
ƒ updated ESD and Schaffner requirements
ƒ changed pinout
ƒ updated description of wakeup functionality
ƒ updated description of INH functionality
ƒ updated soldering information according the green package requirements
ƒ block diagram – serial diode added to the LIN pullup source to comply with the implementation
ƒ application diagram – capacitor on WAKE placed in front of the serial resistance
ƒ pin description – WAKE pin description corrected
ƒ document footer: introduced revision number and date, introduced http link
ƒ Vbb ranges for parameters aligned with the Key Technical Characteristics and the LIN protocol
requirements – 7-18V for LIN-related parameters, 5-26V for others
ƒ Vbb for standby and sleepmode consumption limited to 5V-18V
ƒ Vcc accuracy specified until 50mA in two accuracy ranges
ƒ voltage on pin WAKE extended to –Vbb in Table 2 and Table 5
ƒ par. 2.4: indicating 50mA current capability of Vcc
ƒ I_out_max specified for 30mA and 50mA in Table 2
ƒ Tjunc in Table 5 updated to 165°C
ƒ Figure 4: clarified descriptions of the mode transitions to indicate edge-sensitivity on EN pin
ƒ Figure 1 and Table 3: explicit picture and note about push-pull output on RxD output
ƒ Figure 6: typing error correction in the figure title
ƒ Delta_VH in Table 9: max limit corrected and typical value added
ƒ specification of stabilization capacitors on Vcc added to Table 2 and par. 6.1.
ƒ added max. threshold of thermal shutdown in Table 2 and Table 10
ƒ corrected typing errors and wording in Figure 4
Preliminary
Preliminary
ƒ changed negative maximum rating voltage on WAKE pin – see Table 2 and Table 5
ƒ maximum rating of LIN and WAKE pins adopted to ±45V in Table 2 and Table 5
ƒ corrected note 1 of Table 9 (regarding trimming for another application)
ƒ package drawing updated by a better readable image (no content changes) in par. 9.0
ƒ input/output levels of digital pins re-defined in terms of absolute voltage – see Table 9
ƒ clarified statement on the indefinite short-protection in par. 2.2
AMI Semiconductor – March 2007, M-20544-001
16
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